Txhuam cov txheej txheem thiab kev faib tawm

Txhuam cov txheej txheem thiab kev faib tawm

Sputtering, feem ntau yog hais txog lub magnetron sputtering, belongs rau lub qia txoj kev qis dua. Txoj kev xav tau ntawm lub tshuab nqus tsev rau 1 x 10-3 torr, xws li 1.3 x 10-3 pa nqus tsev cov pa phem argon (Ar), thiab cov ntaub ntawv yas khoom siv (anode) thiab cov khoom siv hlau (cathode) thiab high voltage direct current (dc ), vim hais tias lub teeb pom kev zoo (ci ntsa tawm) uas ua los ntawm hluav taws xob ua pa ntawm kev siv roj, plasma, ntshav mus hlau atom pob tawm ntawm cov khoom siv, yog tso rau cov khoom yas

·           Ntsiab Cai

·           Them tau cov khoom siv nrog ntau ntawm electron volts lossis siab dua qhov hluav taws xob lub foob pob hluav taws cov khoom nto thiab txaws tawm rau hauv cov roj theem rau qhov kub ntxhov thiab txheej. Tus naj npawb ntawm atoms tawm los ntawm ib qho ion yog hu ua sputtering Yield. Lub siab dua tus Yield, qhov ceev cov qaug tshuaj yuav yog. Qhov siab tshaj plaws yog rau Cu, Au, Ag, thiab qis tshaj yog rau Ti, Mo, Ta, thiab W. Feem ntau nyob rau hauv 0.1-10 atom / ion.

·           Ions tau tsim los ntawm ib qho ncaj qha tam tsho tawm. Ntawm qhov khoom nqus ntawm 10-1-10 Pa, qhov kev kub siab yog siv nruab nrab ntawm ob qho electrodes los ua kev tso tawm.

·           Tam sim no tus ceev hauv ib qho kev tawm txawv qhov sib txawv muaj feem xyuam rau cov khoom siv cathode, cov duab thiab roj yam siab. Plating yuav tsum tau tswj tseg kom ruaj khov sai npaum li sai tau.

·           Txhua yam khoom yuav ua tau rau cov txheej txheem, cov khoom noj khoom haus tseem ceeb heev, tab sis rau cov tsis muaj qhov hluav taws xob yuav tsum yog RF (RF) los yog pulse (pulse) sputtering; Thiab vim tsis muaj hluav taws xob hluav taws xob, txaws zog thiab ceev ceev. Hlau txaug fais fab tuag mus txog 10W / cm2, tsis-hlau <5w>

Diode tsuag:

Lub hom phiaj yog lub cathode, lub plated workpiece thiab cov qauv workpiece yog cov anode, thiab lub siab plating tus nqi tuaj yeem tau thaum cov pa (argon Ar) txog ob peb Pa lossis siab dua

·           magnetron sputtering:

·           Ib qho orthogonal electromagnetic teb yog ua rau ntawm lub hom phiaj cathode, qhov twg cov electron censor siab thiab qhov ion density yog khees me ntsis lawm, yog li hais tias tus nqi qaub ncaug nce ntxiv (los ntawm qhov kev txiav txim ntawm qhov ntau), thiab cov qwj nplawm yuav ncav cuag 0.1 - - 1 lub plhom / min, thiab zaj duab xis adhesion zoo dua li qhov ntawm chav npuas. Nws yog ib qho tseem ceeb tshaj txheej txheem yees tam sim no.

·           Lwm cov yees cov yees muaj xws li kev sib ntxub cov kua qaub, cov tshuaj tua kab thiab cov kua txig sib kis

·           Khoom thiab txheej txheem ntawm plating tshuab (hlau nplaum uas muaj hlau nplaum)

·           Lub tshuab nqus tsev yog lub tshuab nqus tsev, lub qhov tso pa, qhov chaw nqus thiab qhov system tswj. Lub tshuab nqus plab yog muab faib rau hauv lub hwj chim thiab rab phom.

·           Magnetron pluttering phom yog muab faib ua hom dav dav thiab cylindrical yam, ntawm cov hom phiaj ntawm qhov nruab nrab yog muab faib ua hom plaub thiab hom, cov khoom siv phiajcuab siv 30-40%, thiab cylindrical target material ntawv siv> 50%

·           Sputter fais fab mov muab faib rau: DC, RF, mem tes,

·           Dc: 800-1000V (Max) tus neeg xyuas pib, muaj peev xwm yog kev phem teeb meem.

·           Rf: 13.56MHZ, uas tsis yog neeg xyuas pib.

·           Pulse: dav siv, qhov tseeb txoj kev loj hlob

·           Sputtering tam sim no, qhov muaj zog lossis lub zog, thiab kev siab ntsws muaj zog (5 10-1 - 1.0Pa) yuav tsum tau tswj thaum muaj kev sib ntxub. Yog hais tias txhua yam tsis ruaj khov, cov zaj duab xis thickness yuav raug kwv yees.

·           Lub hom phiaj xaiv khoom thiab kev kho mob tseem ceeb heev, purity yuav tsis zoo, zoo tib yam kev ntxhib los mos, tsis muaj npuas, defects, qhov yuav tsum tau du thiab du.

·           Rau qhov ncaj lub hom phiaj, nws yuav tsum tau sau tseg tias lub hom phiaj yog ua thinner tom qab kev sib ntxub thiab tej zaum yuav tawg, tshwj xeeb tshaj yog cov hom phiaj uas tsis yog-hlau. Feem ntau, lub thinnest feem ntawm lub hom phiaj yuav tsum tsis pub tsawg tshaj li ib nrab ntawm cov thawj lub phiaj tuab lossis 5 hli.

·           Lub lag luam hom ntawm magnetically tshuaj tsoo plating yog zoo li cov uas muaj zog chav plating. Ua ntej, lub tshuab nqus tsev yog nqus mus rau 1 10-2pa, thiab tom qab ntawd argon (Ar) ions raug txhaj rau bombarding lub hom phiaj. Thaum lub sij hawm txaws plating ntawm qhov siab ntawm 5 10-1-1.0 Pa, yuav tsum tau them nyiaj rau qhov tam sim no, qhov muaj zog thiab siab. Thaum pib, yog tias muaj lub iav hauv pluaj plating, qhov voltage can be slowly tsa ceg, thiab shutter yuav raug kaw tom qab qhov paug tawm.

Nyob rau hauv cov txheej txheem no, kev siv cov pa hluav taws xob (Ar) ua kom huv thiab ua rau cov khoom siv yas hauv ntu ntawm ntau tus me me, MAO, thiab cov hluav taws xob thiab cov khoom siv yas nqhe dawb huv thiab tsim cov dawb radicals, thiab tuav lub tshuab nqus tsev thiab cov qauv tsim ntawm ib qho chaw, cov qauv ntawm lub koom haum thiab cov dawb radicals tau sau thiab ua theem siab ua ke ntawm tshuaj lom neeg thiab cev nqaij daim tawv lub xeev, tsim ib zaj duab xis nyias mus rau sab nrauv nti.

Zaj yeeb yaj kiab yog thawj tsim los ntawm daim npav substrate roughly nrog cov plaub hau yas plaub hau thiab txuas lawv. Piv nrog feem evaporation plating, txaws plating muaj qhov zoo ntawm cov hluav taws xob ntawm lub txheej thiab cov substrate - qhov adhesion yog ntau tshaj 10 zaug siab tshaj qhov ntawm evaporation plating. Lub tshuab nqus cua evaporation yuav tsum ua rau cov hlau los yog hlau oxide yaj, thiab cov cua kub yuav tsum tsis txhob siab, txwv tsis pub, cov roj tso rau hauv cov hluav taws kub substrate kub thiab hlawv cov yas substrate. Cov kua nplaum nplaum yuav tsum tsis pub dawb ntawm lub zog ntawm lub ntiajteb txawj nqus, thiab cov haujlwm ntawm lub hom phiaj thiab cov substrate tau teem caij ua dawb. Hauv thawj theem pib ntawm zaj yeeb yaj duab tsim, cov nucleation ceev yog siab, thiab cov yeeb yam tsis tshua muaj nyias qhov hauv qab 10nm thiaj ua tau. Lub phiaj xwm muaj lub neej ntev thiab tuaj yeem ua haujlwm tau ntev ntev. Cov phiaj xwm khoom yuav ua tau rau ntau yam qauv, nrog rau kev tsim tshwj xeeb ntawm lub tshuab kom zoo tswj thiab feem ntau cov khoom ua tau zoo.

Txau plating SIV TSIS TXHOB siab siv hluav taws xob ua hluav taws xob los ua cov txheej txheem siv ntshav siab, siv cov txheej txheem cov hlau loj, cov hlau thiab hlau oxides, xws li: chromium, molybdenum, tungsten, titanium, silver, kub thiab lwm yam. Ntxiv mus, nws yog ib qho kev tso tawm txheej txheem, siv cov txheej txheem no kom tau cov txheej txheem thiab yas substrate adhesion ntau ntau dua qhov nqus evaporation txujci. Txawm li cas los xij, cov nqi ua lag luam kuj yog theem siab.