PVD Sputtering Deposition

Sputtering Deposition

Lub hauv paus ntsiab lus: Nyob rau hauv lub tshuab nqus tsev chamber, ib qho roj inert (xws li Ar) yog ionized los ntawm high -voltage hluav taws xob teb los tsim plasma. Qhov zoo them Ar⁺ ions, nyob rau hauv lub acceleration ntawm hluav taws xob teb, bombard lub nto ntawm lub hom phiaj cov khoom. Los ntawm lub zog hloov mus, lub hom phiaj cov khoom atoms yog "sputtered" tawm (hauv lub xeev gaseous) thiab tom qab ntawd tso rau ntawm qhov chaw substrate los tsim ib zaj duab xis. Cov yam ntxwv tseem ceeb: Muaj zog adhesion ntawm zaj duab xis thiab cov substrate, siab uniformity ntawm cov khoom (ze rau cov muaj pes tsawg leeg ntawm lub hom phiaj cov khoom), thiab ib tug ntau yam ntawm depositable cov ntaub ntawv (hlau, alloys, ceramics, compounds, thiab lwm yam). Cov thev naus laus zis tseem ceeb Magnetron Sputtering (magnetron Sputtering) yog cov cuab yeej siv dav tshaj plaws hauv cov khoom siv hluav taws xob. Los ntawm confining lub zog trajectory ntawm electrons los ntawm ib tug magnetic teb, nws prolongs lub sij hawm sib tsoo ntawm electrons thiab roj, tsub kom lub plasma ceev, li no pab txhawb lub sputtering efficiency thiab nyias zaj duab xis deposition tus nqi, thaum txo lub substrate kub nce. Haum rau cua sov-sensitive semiconductor substrates (xws li silicon wafers).

IKS PVD lub tuam txhab muaj cov txheej txheem kho kom zoo nkauj, cov cuab yeej txheej tshuab, DLC txheej tshuab, kho qhov muag txheej tshuab, thiab PVD nqus txheej txheej, nrog tig - cov haujlwm tseem ceeb muaj. Hu rau peb tam sim no, E-mail: iks.pvd@foxmail.com