Hais Txog Cov Teeb Meem Ntsib Hauv Magnetron Sputtering, Heev Comprehensive!

Txog cov teeb meem uas tau ntsib hauv magnetron sputtering, heev qhia!

IKS PVD, Sovle tag nrho koj PVD txheej tshuab teeb meem, hu rau peb tam sim no, iks.pvd @ foxmail.com

1. Magnetron pluttering & glow discharge teeb meem ntawm cov phiaj sib nqus

a. Txhim khu magnetic teb Bn 300-700gs

b. Txo lub hom phiaj thickness 2-3mm

c. Ua kom ua haujlwm siab

d. Tshem cov av ntawm lub hom phiaj nto

2. Txo qhov kev nruj ntawm qhov chaw

a. tshav kub kho

b. tswj txoj kev tsis

c. mechanical polishing

d. tshuaj polishing

e. electrochemical polishing

f. hauv qab txheej plating los ntawm ua kua theem

g. Txau cov dej hauv qab txheej

3. Kev ua yeeb yam zaj duab xis

a. tu

b. kom qhuav

c. ntshav tu

d. hloov txheej txheem

4. Sputtering deposition ceev yog qeeb

a. Reactive sputtering: nrhiav qhov taw qhia tseemceeb ntawm tus nkhaus ntawm cov vev tsom, yuav nce tus nqi thiab cov txheej txheem zoo dua qub;

b. RF sputtering: ntau zog thiab txo cua siab (piv txwv li 7.5mt)

5. Kev qhia txog acetylene tej zaum yuav ua rau tsis sib haum xeeb tshwm sim nyob rau hauv cov tshuaj tua kab mob, ua rau muaj qhov sib txawv ntawm qhov tso duab zaj duab xis nyob rau hauv lub substrate, yog li xav (xim) kab txaij .

6. Lus Qhia rau lub sij hawm ntev

a. Qhov system txias

b. Shield

c. Fais fab mov arc extinguishing muaj nuj nqi

d. Kub kub ntawm meem hauv phaj

7. Feem ntau ntawm cov hlau nplaum magnetron

a. lwm yam ua tau sib npaug, kev siv lub hwj chim ceev thiab lub sij hawm nyob rau hauv daim duab tuab yog kwv yees li kev faib ua feem. Qhov nce ntawm lub hwj chim yog ua kom nce qhov ceev thiab crystallization ntawm zaj duab xis. Qhov nce los yog qis dua ntawm lub sij hawm muaj feem xyuam rau qhov kub nce siab ntawm substrate thiab lub thickness ntawm zaj duab xis, thiab cuam tshuam rau cov crystallinity

b. Uniformity: optical uniformity, hluav taws xob uniformity thiab film thickness uniformity.

c. Spectrometer, plaub-sojntsuam, zaj duab xis thickness tester.

d. DC: ruaj khov muaj peev xwm, cov khoom siv coj cwj pwm zoo xws li hlau thiab ITO, ruaj khov dej ruaj khov siab

e. RF: High-oscillation, feem ntau siv nyob rau hauv 13.56mhz, siv rau rwb thaiv tsev (SiO2, AL2O3), semiconductor, cov ntaub ntawv hlau, zaj duab xis, tsawg npaum li cas.

8. Radiation los ntawm ib lub hwj chim hluav taws xob

a. hluav taws xob hluav taws xob tshwm sim, tshwj xeeb tshaj yog RF zog

b. pom tias xaiv qhov kev xaiv xa hluav taws xob (AE thiab lwm yam), Kev Raug Fais fab (RF) siv zog 2%, cov kev cai tswj hwm yuav tswj tau nyob rau hauv 1 w.

c. lub hwj chim phim lub thawv thiab cathode ntawm kev sib txuas yuav tsum tau muab thaiv

d. siab tshaj plaws hluav taws xob xaim fais fab sib txig, vim hais tias ntawm lub siab zog fais fab match tsis tau yog, txhais tau hais tias lub siab dua kev xav

e. kom npaj plab me nyuam thiab cev xeeb tub, txhob nyob deb ntawm xov tooj cua zaus

9. Tshawb nrhiav cov pob zeb dub hauv cov yeeb yam oxide vim hypoxia

a . RF cov pa oxidens feem ntau zoo heev, thiab qee cov pa tawm uas ploj lawm nyob hauv zaj duab xis txheej;

b. 10% oxygen tau yaug los txhim kho

c. Soj ntsuam qhov chaw khiav dej mus ze. Yog tias qhov chaw khiav dejnum tsis zoo li tsaus nti raws li xim ntawm lub cev, qhov teebmeem no yuav raug tshem tawm . Yog hais tias tus khiav mus los ntawm qhov chaw qis dua tsaus zog dua lub cev, nws tsis muaj oxygen.

10. Lub sputtering tawm los ntawm Al yog qis tshaj Cu thiab Gr

A. Muab pov thawj cuam tshuam los cuam tshuam yam teeb meem: qhov teeb meem ion energy & peev xwm khiav tawm atomic tsevneeg

b. sputtering: qhov xwm ntawm qhov feem & khiav tawm

c. kev cuam tshuam: qhov loj dua qhov momentum - qhov ntau dua qhov tawm los, kev lag luam feem ntau siv Ar (nqi & sputtering yield xav)

d. txoj kev khiav tawm: me me Al atoms thiab peb lub electrons, adhesion muaj zog, qis qaug zog

e. txawv sputtering tawm ib qho kev niaj hnub nyob rau hauv lub sij hawm Periodic

11. Tshaj siab tshaj plaws ntawm cov hlau nplaum magnetron sputtering dc

a. feem xyuam rau txoj hauv kev: txias, phiaj khoom, qauv ntawm lub hom phiaj

b. Piv txwv: ceramic / Si 5-8 w / c ∀ hlau phiaj 20-40 w / c ㎡

12. Yas txheej

A. teeb meem uas twb muaj lawm

a. dej loj, kev tso cua loj tso

b. non-ncov qaumteb qab zib, qhov sib txawv loj nrog thermal expansion coefficient

c. loj roughness thiab txom nyem tshav kub tsis kam

B. Ceev faj

xaiv ib qho kev xaiv: tsis muaj roughness, tsawg cua tso

b. Nqa nqus zuj zus ntxiv, txheej txheem kub cev tsawg dua

c. Cov txheej txheem npoo av, txheej xim xws li UV organic txheej, plag tu

Ntxiv kev hloov txheej txheem

13. Cov khoom me me ntawm qhov chaw dc sputtering

a. tu teeb meem

b. kab noj plua plav

c. target impurities

d. fais fab tuag mismatch, pib ARC

e. tej zaum yuav tsis tiav oxidation rau reactive sputtering

14. Ntsuas zaj duab xis tuab

a. Pob zeb

b. Cov kauj ruam

c. Metallographic microscope cross section

d. SEM

e. xry nondestructive thickness gauge

15. Lub hom phiaj lom neeg

A. Qhov laj thawj tseem ceeb rau lub hom phiaj lom yog tias qhov sib npaug ntawm qhov nruab nrab yog qhov ntau dua li cov pa tawm ntawm cov pa tawm (ntau cov pa roj carbon ntau dhau los), uas ua rau cov neeg tsis muaj peev xwm ntawm tus neeg xyuas lub hauv paus. Tsuas yog los ntawm qhov ua kom tsis muaj zog, qhov txim hluav taws xob yuav tsum ua. Phenomenon: lub hom phiaj voltage tsis tuaj yeem ncav cuag lub sijhawm ntev, thiab lub hom phiaj ntawm lub plab yog ib txwm nyob hauv kev lag luam uas tsis tshua muaj hluav taws xob, nrog arc tawm; Lub plhom lub hom phiaj yog tshwm sim dawb los yog siv rab koob nrig pov tseg

B. Yuav kom tshem tawm lub hom phiaj lom, yuav tsum siv lub hwjchim ntawm lub cev lossis lub hwj huam hluavtaws (rf) uas yog siv lub hwjchim ntawm dc; Cov kev siv xws li kev txo cov roj ntawm cov pa roj tsw qab, nce lub hwjchim ua kom muaj zog, tu cov pa paug (tshwj xeeb tshaj yog cov roj stains) ntawm cov khoom siv khoom, thiab xaiv cov npoo uas tsis muaj cav tsis zoo uas muaj lub tshuab nqus tsev zoo tuaj yeem tiv thaiv qhov tshwm sim ntawm cov tshuaj lom. Cov hlau nplaum ntub dej hauv cov cua txias hauv cov hom phiaj. Ntev npaum li cas lub dag lub zog ntawm lub zog txaus thiab qhov txias txias zoo, nws muaj me ntsis ntawm lub hom phiaj

C. Lub khauj kuj txuam me ntsis ~ qhov kev sib tsoo yog ua los ntawm cov thev dej, feem ntau raug lom los yog cov khoom raug nyiag. Sputtering target yog poisoned vim hais tias lub zog ntom tsawg heev thiab cov pa roj ntau dhau lawm tuaj yeem tsis vaporized (lossis sputtering) nyob rau lub sij hawm, uas yuav tawm ntawm cov phiaj thiab txo cov hluav taws xob conductivity, yog li nkag mus rau lub xeev qhov tshuaj lom. Lub teeb tsis ci, hnyav scrapped zog mov.

16. Feem ntau lub hom phiaj

M, lub hom phiaj: Ni , Ti, Zn, Cr, Mg, Nb, Sn, Al, Lub, Fe, ZrAl, TiAl, Zr, AlSi, Si, Cu, Ta, Ge,

Ag, Co, Au, Gd, La, Y, We, W, Stainless hlau, NiCr, Hf, Mo, FeNi, thiab lwm yam.

Lub hom phom sij: lub hom phiaj ntawm pob txha, cov pa roj carbon dioxide, lub hom phiaj, lub pob zeb zis oxide, cerium oxide , lub plawv zirconium dioxide, lub hom phiaj niobium pentoxide, lub hom phiaj, titanium dioxide, zirconium dioxide, hom tshuaj tiv thaiv, phiaj, titanium diboride diboride zirconium phiaj, hom, tungsten trioxide target tantalum pentoxide 3 oxidation 2 aluminium, niobium pentoxide target target, target, yttrium fluoride , hom tshuaj, magnesium fluoride, zinc selenide phiaj, phiaj xwm, aluminium nitride silicon nitride phiaj, hom phiaj, pob zeb nitride titanium nitride lub hom phiaj, silicon carbide phiaj, phiaj, titanium acid lithium niobate praseodymium target lanthanum titanate, barium titanate phiaj, phiaj, xee pob phiaj oxide, thiab lwm yam .