Kev Tshawb Fawb Thiab Txoj Kev Txhim Kho ntawm PVD Coating Technology

Kev faib tawm thiab kev tshawb xav ntawm PVD txheej tshuab

Raws li ib hom khoom tshwj xeeb cov duab, nyias zaj duab xis yuav amorphous, polycrystalline thiab monocrystalline. Nws tuaj yeem ua tau ntawm cov ntsiab lus yooj yim lossis cov khoom xyaw, cov khoom tsis haum lossis cov khoom siv organic.

Cov yeeb yaj kiab nyias muaj nyias lub cev (evaporation, sputtering, ion plating, cov plating plating, plasma plating) thiab cov tshuaj dej tshuaj vapor deposition. Cov cuab yeej siv hauv peb lub koom haum yog Lub Cev Lub Cev Lub Cev (PVD).

One.Vacuum evaporation txheej

Kev ua kom cua sov evaporation thiab electron nqaj cua sov cua sov evaporation:

1. Cov hauv paus ntsiab lus:

Tus txheej txheem uas siv cov khoom siv los yog cov khoom ntim ua kom raug muab tso rau hauv ib lub tshuab nqus tsev siab (high vacuum chamber) thiab rhuav tshem (los sis sublimam) cov ntaub ntawv ua yeeb yaj kiab thiab tso rau saum npoo ntawm cov khoom siv los ua haujlwm ua ib zaj duab xis nyias.

2. Yam hom evaporation:

(a) (b) (c) (d)

3. Qhov cuam tshuam rau zaj duab xis zoo:

A. Txoj hauj lwm ntawm substrate

Qhov kev tso kawm zoo ntawm cov substrate yog qhov ua ntej kom tau cov yeeb yaj kiab.

B. Yuav kom paub meej tias qhov loj ntawm membrane, qhov siab yuav tsum qis qis li Pr (Pa).

L nruab nrab yog qhov nrug ntawm qhov evaporation qhov chaw mus rau lub substrate li L (cm).

C. Cov nqi evaporation. Thaum evaporation tus nqi me me, cov roj molecules tam sim ntawd adsorbed ntawm lub tso dej membrane (thiab molecules), uas ua rau cov kab xoob membrane, coarse particles thiab ntau yam tsis xws luag. Ntawm qhov tsis sib xws, daim qauv membrane yog hom thiab compact, lub zog txhua yam, thiab txoj kev nyuab siab hauv daim nyias nyias loj.

D. Qee qhov xwm txheej, thaum lub zog ntawm substrate siab, lub zog ntawm lub zog ntawm cov adsorbed atoms nce kom haum, thiab cov yeeb yaj kiab tsim yog ib qho yooj yim rau crystallize thiab txo qis qij tsis zoo. Thaum lub substrate kub tsawg tsawg, tsis muaj lub zog txaus los muab cov adsorbed atoms, yog li nws yog ib qho yooj yim rau daim ntawv amorphous.

Ob.Magnetron pluttering txheej

Magnetron sputtering yog ib yam tshiab ntawm kev ua kom cov pa dais hauv lub hauv paus ntawm cathode sputtering hauv xyoo 1970s. Vim tias nws ua kom muaj qhov tsis muaj zog ntawm qhov tsis muaj cathode feem ntau thiab feem ntau ntawm qhov kub ntawm substrate los ntawm electrons, nws tau txais kev txhim kho sai thiab daim ntawv thov dav.

1. Magnetron ntaus pob:

Qhov tshwm sim uas lub atoms ntawm lub phiaj nto raug ntaus los ntawm ion bombarding lub hom phiaj yog hu ua sputtering. Sputtering zaj duab xis yog pom thaum lub atoms generated by sputtering yog tso rau saum npoo ntawm lub substrate (workpiece).

Cov hauv paus ntsiab lus ntawm magnetron sputtering:

Magnetron sputtering yog nyob rau thaj tsam ntawm lub plhaub thiab thaj chaw ntawm cov hluavtaws sib txuas mus rau cov kev taw qhia ntawm cov hluav taws xob, nyob rau hauv cov hluav taws xob thiab cov hlau nplaum sib txuas hauv cov hluav taws xob hauv EB, electronics nyob rau hauv daim ntawv ntawm cycloidal log raws lub phiaj ntaws mus rau lub nraub qaum ntawm E thiab B yog tib seem, yog li ntawd txhim kho lub tshuab hluav taws xob, ntxiv cov hluav taws xob sib tsoo nrog cov roj molecules, los txhim kho cov ionization. Yog li ntawd, qhov thib ib hauv electron magnetic teb nyob rau hauv kev tswj ntawm txoj kev khiav, nws tuaj yeem siv rau ionization zog, thaum lub zog sab lim, tsuas yog absorbed los ntawm cov anode (chassis). Cov nram no:

Cov electrons tau ceev nrooj los ntawm lub tebchaw fais fab thiab nce zog, thiab cuam tshuam nrog lub atoms lossis molecules ntawm cov roj, txawm tias lawv ionize, yog li cov plasma tau khaws cia.

Magnetron sputtering yog tswj cov zog ntawm electrons los ntawm kev ntxiv dej ntws hlau nplua nuj mus rau lub hom phiaj, nthuav lawv txoj kev mus ncig ntawm lub hom phiaj, thiab ua kom cov ntshav qis tshaj plaws, yog li tus nqi nplaum plab yog zoo heev.

Secondary electron yield:

Secondary electron yield yog hais txog tus naj npawb ntawm cov electrons hauv ib qho ion bombarding lub hom phiaj. Theoretical analysis qhia tau hais tias theem nrab electron yield ntawm lub hom phiaj hlau yog ywj siab ntawm cov ion zog thaum ion zog tsawg dua 500eV (yeej tsawg dua 1000eV).

Yuam kom:

Magnetron sputtering muaj ib qhov ua haujlwm ntawm 200 ~ 500V, uas pom tau tias qhov siab tshaj plaws ntawm ion lub hom phiaj yog 500eV, thiab cov lus qhuab qhia tau nrawm nrawm yog tig mus rau lub hom phiaj.

Kev sib cuam tshuam ntawm qhov teeb meem ions thiab cov ntaub ntawv:

Kev sib cuam tshuam ntawm kev siv zog ion thiab lub hom phiaj tau tshwm sim hauv:

A. Ib qho me me: cov tshuab qwj nplaum, cov leeg ntog rov qab, lub zog tsis muaj zog, thiab lwm yam khoom hluav taws xob.
B. Deg hauv qhov ua muaj tshwm sim: tu, ua pa taws thiab tshuaj lom neeg.
C. Taw tes rau cov teeb meem, cov kab teeb meem, cov xim kub hnyiab, sib tsoo cascades, ion implantation, xeev amorphous, thiab cov tshuaj hauv cov txheej txheem txheej.

Cov Hom Phom Ntshav:

Sputtering technology tau muab faib ua:

A. Diode kev sib ntxub los ntawm dc glow discharge;

B. Txuas ntxiv rau hauv Tripole los ntawm cov hlab xaim kub tawm;

C. Rf sputtering siv rf paug;

D. Magnetron pluttering tswj kev ci ntsa tawm uas siv ntawm txoj kev khiav ntawm qhov chaw ntawm hlau ntws hlau.

2 magnetron sputtering cathode qauv:

Tam sim no, magnetron sputtering cov cuab yeej siv rau kev siv feem ntau yog siv cov dav hlau plhom (magnetron sputtering cathode) (daim duab). Feem ntau, cov khoom siv me me siv muaj ob yam: VT tshuab: qhov siab ntev tuab (450.5 120 6) mm; ZCK tshuab: 460 100 6. Cylindrical magnetron sputtering cathode kuj maj mam siv hauv cov khoom (daim duab b). Piv nrog lawv, kev siv cov khoom dav hlau ntawm qhov khoom tsuas yog 20-30%, uas yog, kev siv tus nqi tsawg tsawg.

Xam ib daim duab b

Xam a yog qhov sib txawv ntawm cov hlau nplaum uas ua los ntawm cov hlau nplaum tas li uas muaj hlau nplaum magnetron sputtering cathode, lub hom phiaj ntawm kev sib txuas nrog tus khau khau. Nraum ntawm cov khoom siv raws N Nias lub khawm, nyob rau hauv nruab nrab ntawm ib tug S ncej khau, N thiab S ncej khau feem ntau rov qab polarity ntawm strontium ferrite los yog ndfeb cov hlau nplaum. Muab ib txoj kab permeability ntawm cov ntshiab hlau rov qab txuas rau lwm qhov kawg ntawm cov hlau nplaum tas li, uas yog los tsim cov hlau nplaum ntawm cov hluav taws xob hauv kev sib nqus.

Daim duab b yog ib qho cylindrical hollow magnetron cathode, uas yog lub hom phiaj cathode nrog lub hlau nplaum hauv lub cylindrical phiaj, nrog N thiab S ncej zoo txheej txheem, dej txias thiab dynamic sealing.
Cov hauj lwm ntawm txoj khau khau: tsim ib qho kev sib txuas ntawm sib nqus uas muaj qhov sib txawv me me.

Tam sim no, peb nquag siv cov khoom sib dhos phom sij ruaj khov: barium ferrite (BaO · 6F1e2O3), strontium ferrite (SrO · 6F1e2O3), ndfeb daim nplaum magnet.
Magnetron tshuab electrode:
Tswv yim magnetron qhwv lub tshuab electrodes muaj plaub yam hauv qab no:

(a) coaxial tus kheej kheej kheej; (b) hom ca; (c) cone (S rab phom) hom; (d) dav hlau lossis cylindrical hollow hom
1 - lub substrate; 2 - cov khoom siv khoom; 3 - ntaub thaiv npog

3 txoj kev sib tshuam:
Daim duab teeb duab ntawm magnetron sputtering txheej tshuab:

Sputtering txheej txheem tsis:

Txoj kev sib raug zoo ntawm lub hom phiaj ntawm qhov muaj zog ntawm qwj npliag thiab lub hom phiaj ntawm kev sib sib zog nqus J yog raws li nram no: uJ = K1
Qhov twg K1 yog qhov khoom tso cai ntawm qhov muaj zog ntawm lub zog, ib qho tas li.

Lub phiaj xwm ceev tam sim no yuav txiav txim siab raws li lub hom phiaj ntawm qhov xaiv qhov siab thiab lub hom phiaj muaj zog ceev ceev.

Txo cov Ar siab yog pab kom txhim kho cov nqi dej nqi ntxiv, thiab los txhim kho txheej pov npev thiab zaj yeeb yaj kiab. Magnetron sputtering Ar siab feem ntau yog xaiv li 0.5 Pa, tus impedance ntawm cov pa tawm nrog cov zuj zus ntawm Ar siab nce. Magnetron pluttering, yuav kho Ar siab kom tsim nyog, ua lub zog qhov ceev thiab qhov hluav taws xob, feem ntau, thaum tib lub sij hawm nyob ze rau nws lub hom phiaj thiab qhov zoo tshaj plaws tus nqi. Yog li ntawd, txhim kho txoj cai txheej txheem ntawm kev tso dej tawm yog: ze li sai tau rau cov phiaj xwm ceev ntom nqi; Lub phiaj xwm voltage yog ze rau qhov pom tias muaj nqis tshaj plaws.

A. Sputtering ntawm ntshiab hlau zaj duab xis:
Hauv lub cev vapor deposition, ob leeg evaporation thiab sputtering yog tsim rau ntshiab hlau films, tab sis tus nqi ntawm evaporation yog siab dua.
Tam sim no, cov ntaub ntawv siv tau yog: Al, Ti, Cu, Cr, thiab lwm yam

B. Sputtering ntawm zaj duab xis alloy:
Ntawm lub cev vapor deposition techniques, sputtering yog feem ntau haum rau lub deposition ntawm alloy films. Txoj kev sib txuam dai nrog rau ntau hom kev sib tw, Mosaic target sputtering thiab alloy target sputtering.
Cov khoom siv ntawm lub sijhawm tam sim no muaj xws li AlTi, ZrTi, CuTi thiab lwm yam.

C. Sputtering ntawm compound film:
Feem xyuam nrog cov zaj duab xis feem ntau yog hais txog zaj duab xis txheej ua los ntawm kev sib xyaw ua ke ntawm cov ntsiab lus hlau nrog C, N, B, S thiab lwm cov ntsiab lus uas tsis yog xim hlau. Cov txheej txheem plating yog dc sputtering, rf sputtering thiab reactive sputtering.

1. Dc sputtering compound zaj duab xis yuav tsum tau siv, Piv txwv li, kev sib txuas lus kub lub hom phiaj xws li SnO2, TiC, MoB thiab MoSi2 feem ntau yog los ntawm hmoov metallurgy, uas yog kim heev.Qhov plating ntawm ITO pob tshab conductive zaj duab xis yog daim ntawv thov ntawm dc sputtering compound zaj duab xis.

2. Rf sputtering tsis yog txwv tsis pub los ntawm seb lub hom phiaj yog kev ua los yog tsis. Nws tuaj yeem ua tau hlau lossis insulated ceramic phiaj.

3. Reactive sputtering yog thaum lub plab xa cov hlau, tib lub sij hawm rau txheej chamber rau hauv cov roj uas muaj cov ntsiab lus uas tsis yog x-xias. TiC (dub) SIV Ti phiaj, thiab cov roj ua haujlwm yog Ar + C2H2 lossis Ar + CH4.

Cov tshuaj tua kab mob ua rau cov roj ntsha tuaj yeem tsis pom zoo nrog cov yeeb yaj kiab uas tau muab tso rau hauv cov khoom siv hlau los ua ib zaj yeeb yaj kiab, tab sis kuj tau nrog cov khoom siv los tsim ib qho chaw hauv lub phiaj xwm, uas yuav ua rau lub phiaj xwm cov khoom siv thiab sib zog kom txo cov txheej pov ntawv txawm yog los ntawm qhov kev txiav txim ntawm qhov ntau, uas yog yooj yim ua rau lub hom phiaj lom.

Thaum pib ntawm lub tebchaw nyob rau hauv cov txheej txheem ntawm kev ywj pheej, tsuas yog mus rau cov ntshiab Ar, thiab maj mam nce cov tshuaj ua kom roj (C2H2 lossis N2, thiab lwm yam), thaum pib ntawm cov pa roj tsuas pib dhau, , thaum muaj cov pa roj carbon dioxide nce mus txog qee yam qis, tus nqi qwj tsiav yog pib hloov txoj kev hloov, thiab tom qab ntawd yuav ua rau kom muaj qhov ua kom muaj roj ntau ntxiv, tus nqi qaug tshuaj yuav pom tias muaj kev sib txawv dua. Nws tau pom tias cov kev taw qhia ntawm tus txheej txheem rov rau hauv qee yam ntawm qhov kev nkhaus ntawm qhov kev ua tsis ncaj ncees, tshwm "voj vwm curve" duab. Qhov no yog hu ua "lub hom phiaj ntawm qhov kev nkeeg". Saib nram qab no:

Target lom nkhaus
Cov kev ntsuas kom tiv thaiv lub hom phiaj lom:
. Txhim khu extraction tus nqi ntawm lub tshuab nqus tsev;
Txo qhov ua kom roj.
Rho cov pa roj tawm ntawm lub hom phiaj.

Cov piv txwv ntawm cov yeeb yaj kiab cov yeeb yaj kiab muaj raws li nram no:

Cov khoom siv membrane
artifacts
muaj nuj nqi
TiN,
High speed steel ntsis thiab milling cutter
Nyuaj hnyav-resisting
Stainless hlau rooj thiab pluaj
Kub kho kom zoo nkauj
Ceramics thiab vuas
Kub kho kom zoo nkauj
ITO
Pob tshab conductive iav
Transparent conductive
SiO2
Pob tshab conductive iav
Txwv tsis pub sodium ion diffusion
Al2O3
Integrated Circuit Court Silicon nti
Rho tawm hlais tawm
MgF2
Optical lens
Rho tawm ntawm txoj kev xav
TiC
Stainless steel xov tooj thiab cov khoom
kho kom zoo nkauj

Magnetron sputtering ion plating tshuab:

Tom qab 80 s, txuas qhov kev sib tw ntawm cov hlau nplaum magnetron yog hu ua magnetron sputtering Ion Plating, hauv qab no hu ua sputtering Ion Plating (Sputtering Ion Plating, SIP). Peb lub koom haum tam sim no muaj xws li kev siv cov khoom siv ntawm Plating zaj duab xis, namely kev siv cov tshuab.

1. Kev tsim cov txheej txheem ntawm cov zoo nkauj txheej (TiN los yog TiC) los ntawm magnetron sputtering ion plating technology:

2. Cov txheej txheem txheej txheem PVD:

Abstract: raws li qhov yuav tsum tau ntawm zaj duab xis, qib ntawm lub tshuab nqus tsev plays lub luag hauj lwm tseem ceeb heev nyob rau hauv qhov zoo ntawm zaj duab xis. Rau cov khoom tsim los ntawm peb lub koomhaum, qhov degree nqus ua ntej yuav tsum ua kom tau zoo txog kev ua yeeb yaj duab yuav tsum ncav cuag 5.0 10-3pa (siv sijhawm ntev li 30-60 nas).

Kev siv cua sov: Thaum twg lub hoob nqus nqus tsev (piv txwv, 2.0 10-2pa), pib cua kub thiab qhib lub thav duab.

Lub Hom Phiaj: txo los yog tshem tawm cov roj tawm hauv cov roj ntsha adsorbed ntawm cov khoom siv thiab lub tshuab nqus tsev nqus tsev, ua kom zoo thiab ua tiav ntawm cov yeeb yaj kiab kom tau raws li cov kev cai, tab sis nws yuav tsum tau sau tseg tias:

A. Hauv qhov tseeb, lub cua sov tuaj yeem muab rau, uas tuaj yeem tiv thaiv tau qhov chaw ntawm cov khoom tsis raug oxidized.
B. Yuav tsum qhib qhov qhib thaum muaj cua sov pib.

Target cleaning (tseem hu ua taw tes hom phiaj): lub hom phiaj tsuas yog qhib thiab ntxuav thaum lub tshuab nqus tsev tuaj txog ntau yam (qhov yuav tsum tau muaj ntau yam ntawm cov khoom tsim los ntawm peb lub hoobkas yog 7.0 10-3 ~ 5.0 10-3pa).

Lub hom phiaj: tshem tawm cov adsorbed gas thiab ntxuav lub txheej ntawm nplaim ntawm lub hom phiaj.

Ion tu: artifacts tom qab kev kho cov tshuaj tua kabmob, qhov chaw yuav tseem yuav muaj qee qhov av, tej zaum kuj muaj oxide txheej me ntsis, ion tu yog tshem tawm cov av thiab qhov chaw oxidation txheej yog ib txoj kev zoo. Rau Ar roj sau lub siab muaj zog nyob hauv lub tshuab nqus tsev, khoom artifacts thiab kev thuam tsis zoo los ntawm glow paug nyob rau tib lub sijhawm, los ntawm ionization ntawm Ar ion nyob rau hauv qhov kev txiav txim ntawm cov hluav taws xob, lub siab tshaj plaws lub zog bombarding artifacts, thiab ua tiav lub av ntawm lub nto ntawm cov khoom ua haujlwm txaws tawm, huv si thiab lub hom phiaj ntawm kev qhib rau saum npoo ntawm cov khoom thauj.

Zaj duab xis ua: thaum lub siab ua haujlwm ntawm cov pa roj carbon dioxide nce mus txog ib theem twg, lub hom phiaj yog qhib thiab tsim nyog muaj roj ntau ntxiv ntxiv rau kev sib ntxais, thiab thaum kawg yuav tsum tau cov yeeb yaj kiab. Tam sim no, nitride zaj duab xis, oxide film thiab carbide film yog tau los ntawm nitrogen (N2), oxygen (O2), methane (CH4), acetylene (C2H2), carbon monoxide (CO) thiab lwm cov roj cua.

Matters xav mloog cov zaj yeeb yaj kiab hauv tus txheej txheem:

1. Tus Ar puas khiav thiab muaj kev kub ntxhov?
2. Ua ntej qhib lub hom phiaj, muab kev thev qhov siab, pib lub thav duab rau sab nraud, thiab xyuas seb puas muaj luv luv hauv lub npav.
3. Lub hom phiaj qhov muaj tseeb, lub hom phiaj tam sim no, qhov siab thiab kev thwj rau tam sim no yuav tsum tau them nqi rau lub sijhawm ua zaj yeeb yaj kiab.

Txias: Cov kub siab yuav raug tsim los ntawm cov txheej txheem ua yeeb yaj kiab, kom tsis txhob muaj cov txheej txheem ntawm kev ntxhov siab tshwm sim los ntawm qhov kub qhov txawv ntawm sab hauv thiab sab nraum ntawm lub qhov chaw fais fab. Tom qab ua zaj yeeb yaj kiab, yuav tsum tau txias kom txias ua ntej tso tawm zaj duab xis.
Nqus plua plav chamber. Chav tsev thiab lub tshuab nqus tsev nqus tsev.

Lwm yam tsis muaj feem xyuam ntawm magnetron sputtering ion plating:

Magnetron pluttering workpiece muaj peb hom hluav taws xob kev txuas: av, tshem tawm thiab kev thuam.
Qhov txheej txheem feem ntau yog lub tshuab nqus tsev fais fab hauv av raws li anode, thiab cov kev cai ntawm xoom peev xwm.
Kev ncua yog qhov txheej txheem ntawm insulating lub workpiece ntawm lub anode (vaj tse) thiab cathode thiab tshem tawm hauv plasma.
Txoj kev cai yog ntxiv kaum ntawm volts rau pua pua volts ntawm kev tsis zoo siab rau cov haujlwm workpiece, thaum qhov kev sib thooj yog xoom uas yog grounded.

1. Ion sij hawm tuaj txog:

Nyob rau hauv ion plating, cov nyhuv teeb meem ions ntawm tus qauv thiab cov khoom ntawm zaj duab xis mas nyob ntawm lub zog ntawm ion thiab cov ion flux.
Nyob rau hauv ion plating, lub zog tau los ntawm qhov teeb meem ion ntawm txhua qhov chaw atomized yog hu ua lub zog nce nqi.
Ea = Ei (tsev)
Hom Ei yog lub zog ntawm qhov teeb meem ion (tsev), kuv / Φ Φ rau ions kom ncav cuag dua ib.

2. Kev Ntseeg thiab Tamsis No:

Cov tswv yim tsis yog ntawm txoj kev ion plating yog qhov thev plaub thiab qhov ceev ntawm qhov workpiece tam sim no. Tam sim no, peb lub Hoobkas hauv plating TiN los yog TiC txheej txheem, kev tswj kev tswj ntxiv hauv -100 ~ -400V, thiav tam sim no hauv 2 ~ 6A .

3. Pulsed sputtering:

Pulsed sputtering feem ntau POM NPAJ VIM LI CAS.

Tos sij hawm yog T, lub sij hawm ntawm lub plhu hauv txhua lub voj voog yog t-delta T, delta T yog lub sij hawm zoo (qhov dav) ntxiv rau lub hom phiaj. VV thiab V + yog qhov siab ntawm qhov tsis zoo thiab zoo pulses ntxiv rau lub hom phiaj, feem.

4. Cov neeg mob tsis zoo thaum ua haujlwm:

Tam sim no, lub ntsiab qauv siv nyob rau hauv cov khoom yog: vt-1200, SVS thiab COM nruam txheej tshuab, zck-1500 thiab lwm yam sib txawv ntawm cov khoom cuab yeej.

Yam tshwm sim txawv txav
Lub txim
a.
Cov ntaub thaiv npog ntawm lub tsheb tsis zoo thaum lub phiaj yog ntxuav
Qhov nplaim ntawm cov khoom yog paug, uas ua rau cov yeeb yaj duab ntawm cov khoom tom qab tawg txheej
B
Kev ntsuas luv luv yog tshwm sim thaum lub qhov ntxuav ion
Kev sim ua haujlwm NG tom qab ua zaj duab xis (tawm tsam)
C
Thaum lub sijhawm ua zaj yeeb yaj kiab, cov pa roj carbon dioxide txaus siab dhau lawm (piv txwv li, C2H2), ua rau lub hom phiaj lom
Tom qab cov khoom tuaj tawm ntawm lub tshuab ua kom sov, zaj duab xis lo xim los yog xim tsis sib xws yog pom tseeb
D
Lub phiajcim cua txias tsis qhib thaum lub sijhawm qhib
Khoom puas tsuaj, ua rau muaj kev cuam tshuam loj heev

IKS PVD, lub tshuab nqus tsev tshuab, hu rau: iks.pvd@foxmail.com